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BGA desktop infrared reflow oven for SMD assembly line T-962A benchtop IR IC heater

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Key attributes

Other attributes

Condition
New

Applicable Industries
Machinery Repair Shops, Home Use, Printing Shops, reflow oven, PCB welding

Showroom Location
None

Video outgoing-inspection
Provided

Machinery Test Report
Provided

Marketing Type
Ordinary Product

Warranty of core components
1 Year

Core Components
motherboard

Place of Origin
Shandong, China

Warranty
1 Year

Key Selling Points
Accurate temperature control

Weight (KG)
15 KG

Type
Reflow Solder

Brand Name
puhui

Usage
pcb reflow soldering

Voltage
220V/110V

Dimensions
51*45*33MM

Rated Duty Cycle
100%

Rated Capacity
1.5KW

Current
7A

Name
Infrared reflow oven

Application
PCB soldering/CHIP/SOP/PLCC/QFP/BGA

Heating Zones
1

Mode Of Heating
Infrared Emission

Soldering area
300*320mm

Temperature range
0-280℃

Welding time
8 Mins

Soldering waves
8

Weight
15kg

Certification
CE

Packaging and delivery

Selling Units:
Single item

Single package size:
51X45X33 cm

Single gross weight:
16.000 kg

Lead time

Quantity (sets)1 - 10 > 10
Lead time (days)7To be negotiated

Customization

Customized logo
Min. order: 100
Customized packaging
Min. order: 100
Graphic customization
Min. order: 100

Product descriptions from the supplier

Minimum order quantity: 1 set
$260.00

Variations

Total options:

Shipping

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