T-962A smt reflow oven/desktop reflow oven/infrared bga reflow oven
Soldering area: 300*320mm
Overall dimensions: 43*37*26cm
Packing dimensions: 51*45*33cm
Cycle time: 1-8 min
Voltage: AC110V-AC220V /50-60HZ
Net weight: 12.5Kgs
Gross weight: 15Kgs
(1) Large infrared soldering area: 300*320mm (T-962A)
(2) Eight soldering waves
(3) Special heat up and temperature equalization
Big power of energy efficient Infrared heating and air circulation to re-flow solder.
(4) Ergonomic design, practical and easily operated
(5) Large number of available functions
Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.