T-890 BGA rework station,laptop motherboard repair tools,reballing station,bga machine
Complete machine power
Rated voltage and frequency
AC 110-230 V 60/50Hz
Infrared lamp body power
Preheating chassis power
Working bench size
320 X 330 mm
Infrared lamp body heating size
60 X 60 mm
Preheating chassis preheating size
245 X 260 mm
Preheating chassis temperature range
0 °C-350 °C
316mm X 410mm X 290mm
1. Eight temperature waves
2. Intelligent temperature wave heating, solder/unsolder automatically.
3. Three-dimensional adjustable lamp body, adjustable PCB holder, laser light, suitable for unsoldering all-dimensional components.
4. PID intelligent temperature control can avoid the IC damage due to the fast or uninterrupted heating up.
5. Super hot melt system, use infrared welding technology, can suit for a variety of computer, notebook, play station’s BGA components, especially in a Northbridge/ Southbridge chipset of computer.
6. Easy operate, perfect LCD display, no need to connect with the PC
7. Good build quality, big working area.
Warranty – the main body maintains for one year and the spare parts maintains for three months.
Service – provide the immediate network online Q/A and the technical advisory work service
Safe packing and fast delivery by air express.
*** Hello friend, we are the manufacturer for reflow oven and bga rework station in China, please feel free to contact us if you have interest in our products, thank you